Elektor Reflow Oven and BGA

[shadders]

Hi,

A quick question hopefully.

has anyone purchased the Elektor reflow Oven and used it to solder BGA IC's at aLL.

If so - was it successful - or is there any issues that could make the result be less than 100% successful ?. Thanks.

Regards,

Shadders

[ricks]

Good luck with any BGA package and any form of manual assembly. The problem is how to place the part in the accuately and proper proportioned pasted pads and then assure that the solder columns reflow precisely.

Using automated assembly, one usually has a few fudicial on the board and around the component which is used by the pick & place equipment's imaging processor to accurately place the part.
So how does one figure out if the solder columns reflowed properly, well in most cases they use xray inspection by taking xray slices of the solder joints and look for places where the solder paste did not make contact with the balls in order to make a proper connection. Another method is using flying probe testing where you measure nodal impedances against the database of a known good assembly. Then test the PCA/parts as a final verification step to see if it is working or not.

What you are asking is not trivial and requires much experience in order to be able to get yields and reliable solder joints.

I suggest to stay away from all BGA packages unless you are going to manufacture at an assembly house who knows what they are doing or you will be guaranteed to have problems.

Rick

[shadders]

Hi Rick,

Thanks for the reply - was very helpful.

As i expected, this would be a difficult task - so i would have to limit the designs to either leaded packages or use a thrid party with expertise and capability.

Thanks again for helping.

Regards,

Shadders.